利用Wafer表面Chemical、UPW及物理方式的单叶式Etching、Cleaning设备

Feature

• 1Xnm级工程能力

• 2. Compact design, High throughput

• 3. 污染控制技术

• 4. High end Material
• 5. Green Factory Technology
• 6. Multi Process Nozzle configuration

• 7. 确保高稳定性和可靠性

• 8. Easy Maintenance Design
• 9. SEMI Standard, CE Mark

Application

• - Semiconductor, OLEDoS, LED Process, R&D
• - Pre/Post Clean(DHF, SC1, Spray, IPA Dry)
• - Backside Clean(Front & Backside Megasonic)
• - Backside strip(Poly Decap, Bevel Etch)