Wafer 표면을 Chemical, UPW 및 물리적 방식을 이용한 매엽식 Etching, Cleaning 설비

Feature

• 1. 1Xnm 급 공정 능력
• 2. Compact design, High throughput
• 3. 오염제어기술
• 4. High end Material
• 5. Green Factory Technology
• 6. Multi Process Nozzle configuration
• 7. 높은 안정성과 신뢰성 확보
• 8. Easy Maintenance Design
• 9. SEMI Standard, CE Mark

Application

• - Semiconductor, OLEDoS, LED Process, R&D
• - Pre/Post Clean(DHF, SC1, Spray, IPA Dry)
• - Backside Clean(Front & Backside Megasonic)
• - Backside strip(Poly Decap, Bevel Etch)