FOUP cleaner which is used in semiconductor cleans FOUP(Front Open Unified Pod) for 300mm wafer in manual / auto.

Feature

• 1. Auto convey by articulated robot (Fully automatic system)
• 2. High throughput (Optimization of the cleaning process)
• 3. Compact equipment (Minimize footprint)
• 4. High efficiency-cleaning uniformity & dry solution
• 5. Several types of FOUP & FOSB (Front Opening Shipping Box) applicable (SEMI Standard compliant FOUP)
• 6. Auto FOUP cover system (Opener) prevents inflowing particle contamination
• 7. Apply FAB automation system (OHT, RGV, Operator)
• 8. FOUP stock area (Store FOUP before & after cleaning)
• 9. Damaged FOUP, and wafer detecting function (Option)
• 10. VCD module (Option)
• 11. SEMI standard, CE mark

ONE STOP TOTAL SOLUTION

• - Semiconductor FOUP Cleaning Process (300mm, 450mm)