It is a single etching and cleaning equipment using chemical, UPW and physical method on wafer surfaces.

Feature

• 1. 1Xnm level process capability
• 2. Compact desigh & high throughput
• 3. Contamination control technology
• 4. High end Material
• 5. Green Factory Technology
• 6. Multi Process Nozzle configuration
• 7. High stability & reliability
• 8. Easy Maintenance Design
• 9. SEMI Standard, CE Mark

Application

• - Semiconductor, OLEDoS, LED Process, R&D
• - Pre/Post Clean(DHF, SC1, Spray, IPA Dry)
• - Backside Clean(Front & Backside Megasonic)
• - Backside strip(Poly Decap, Bevel Etch)