It removes a metal layer and photo-resist on a sapphire wafer used in a LED process through physical/chemical method.

Feature

• 1. Wafer auto conveyance by index robot and transfer robot
• 2. Minimize metal contamination
• 3. Able to collect metal of wafer
• 4. Energy saving mode
• 5. Compact equipment (Minimize footprint)

Application

• - LED process, 100mm (4"), 200mm (8")