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FOUP Cleaner

  • FOUP Cleaner which is used in semiconductor cleans FOUP
    (Front Open Unified Pod) for 300mm wafer in Manual/Auto.
    Feature
  • 1. Auto convey by articulated robot (Full auto system)
  • 2. High throughput (Optimization of cleaning process)
  • 3. Compact equipment (Minimizefootprint)
  • 4. High efficiency-cleaninguniformity &dry solution
  • 5. Several types of FOUP&FOSB applicable (SEMI Standard compliant FOUP)
  • 6. AutoFOUPcoversystem (Opener) preventsinflowing particle contamination
  • 7. Apply FAB automation system (OHT, RGV, Operator)
  • 8. FOUP stock area (Store FOUP before & after cleaning)
  • 9. Damaged FOUP, wafer detecting function (Option)
  • 10. VCD Module (Option)
  • 11. SEMI Standard, CE Mark
    Application
  • - Semiconductor FOUP Cleaning Process (300mm, 450 mm)