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Metal Lift Off

  • It removes metal layer and photoresiston sapphire wafer used in LED
    process through physical/chemical method
    Feature
  • 1. Wafer auto conveyance by index robot and transfer robot
  • 2. Minimize metal contamination
  • 3. Able to collect metal of wafer
  • 4. Energy saving mode
  • 5. Compact equipment(Minimize footprint)
    Application
  • - 4"Wafer – UPEH 120ea (Compatible with8" Wafer)